Description
830 Tie Points Transparent Solderless Breadboard
Standard Hole Spacing: 2.54mm (0.1 inch)
Dimensions: 165 x 54 x 8.5mm
Weight: 80g
Max Voltage: 300V
Max Current: 3-5A
Wire Size: 20-29AWG
Note:
- 2 power lanes, 200 tie points
- 1 double strip, 630 tie points
- prototype-friendly
- no need for soldering
- double-sided tape at the bottom
- has interlocking parts to join multiple breadboards together