Description
A Compact Powerhouse for Physical AI and Robotics
The NVIDIA® Jetson AGX Thor™ Developer Kit gives you unmatched performance and scalability. It’s powered by the NVIDIA Blackwell GPU and 128 GB of memory, delivering up to 2070 FP4 TFLOPS of AI compute to effortlessly run the latest generative AI models—all within a 130 W power envelope. Compared to NVIDIA Jetson AGX Orin™, it provides up to 7.5x higher AI compute and 3.5x better energy efficiency.
Features
- Extreme AI Performance for Robotics
Powered by Jetson T5000 module, the Blackwell GPU with 2560 cores and 96 Tensor Cores, delivering up to 2070 FP4 / 1035 FP8 TFLOPS—ideal for running a wide range of generative AI models such as LLM, VLA (like NVIDIA® Issac™ GR00T N), ViT, etc.
- Optimized for Transformer and Multimodal Workloads
Built-in Transformer engine, MIG (Multi-Instance GPU) support, and 128 GB LPDDR5X (273 GB/s) memory enable efficient training and inference at the edge.
- Real-Time Processing and Control
Features a 14-core Arm® Neoverse®-V3AE CPU for fast, deterministic performance in real-time robotic applications.
- High-Speed Sensor and Network Integration
Supports up to 4× 25GbE connections, 140W power supply, and a rich I/O set including HDMI, DP, USB 3.2/USB-C, CAN, and GbE for high-bandwidth and low-latency real-time sensor fusion.
Specifications
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Jetson AGX Thor Developer Kit |
Jetson T5000 Module |
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AI Performance |
2070 TFLOPS (FP4—Sparse) |
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GPU |
2560-core NVIDIA Blackwell architecture GPU with 96 fifth-gen Tensor Cores Multi-Instance GPU (MIG) with 10 TPCs |
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GPU Max Frequency |
1.57 GHz |
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CPU |
14-core Arm® Neoverse®-V3AE 64-bit CPU 1 MB L2 cache per core 16 MB shared system L3 cache |
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CPU Max Frequency |
2.6 GHz |
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Vision Accelerator |
1 个 PVA v3 |
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Memory |
128 GB 256-bit LPDDR5X 273 GB/s |
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Storage |
1 TB NVMe M.2 Key M Slot |
Supports NVMe through PCIe Supports SSD through USB3.2 |
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Video Encode |
6x 4Kp60 (H.265) 12x 4Kp30 (H.265) 24x 1080p60 (H.265) 50x 1080p30 (H.265) 48x 1080p30 (H.264) 6x 4Kp60 (H.264) |
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Video Decode |
4x 8Kp30 (H.265) 10x 4Kp60 (H.265) 22x 4Kp30 (H.265) 46x 1080p60 (H.265) 92x 1080p30 (H.265) 82x 1080p30 (H.264) 4x 4Kp60 (H.264) |
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Camera |
HSB camera via QSFP slot USB camera |
Up to 20 cameras via HSB Up to 6 cameras through 16x lanes MIPI CSI-2 Up to 32 cameras using Virtual Channels C-PHY 2.1 (10.25 Gbps) D-PHY 2.1 (40 Gbps) |
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PCIe* |
M.2 Key M slot with x4 PCIe Gen5 M.2 Key E slot with x1 PCIe Gen5 |
Up to Gen5 (x8 lanes) Root port only—C1 (x1) and C3 (x2) Root Point or Endpoint—C2 (x1), C4 (x8), and C5 (x4) |
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USB* |
2x USB-A (3.2 Gen2) 2x USB-C (3.1) |
xHCI host controller with integrated PHY (up to) 3x USB 3.2 4x USB 2.0 |
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Networking* |
1x 5GBe RJ45 connector 1x QSFP28 (4x 25 GbE) |
4x 25 GbE |
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Display |
1x HDMI 2.0b 1x DisplayPort 1.4a |
4x shared HDMI2.1 VESA DisplayPort 1.4a—HBR2, MST |
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Other I/O |
QSFP connector M.2 Key E expansion slot (WLAN/BT, x1 PCIe, USB2.0, UART, I2C, I2S) M.2 Key M connector (NVMe for storage) PCIe x4 lane, I2C, PCIe x2 lane 2x 13-pin CAN header 2x 6-pin automation header LED JTAG connector (2x 5-pin header) 1x fan connector —12V, PWM, and Tach Audio panel header (2x 5-pin) Microfit power jack RTC backup battery connector 2-pin |
5x I2S/2x audio hub (AHUB), 2x DMIS, 4x UART, 4x CAN, 3x SPI, 13x I2C, 6x PWM outputs |
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Power |
40W – 130W |
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Mechanical |
243.19 mm x 112.40 mm x 56.88 mm Thermal Transfer Plate (TTP) and optional fan or heat sink |
100 mm x 87 mm 699-pin B2B connector Integrated Thermal Transfer Plate (TTP) with heatpipe |
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* Refer to the Software Features section of the latest NVIDIA Jetson Linux Developer Guide for a list of supported features.
** Low-speed I/O spec is subject to change.
Developer Kit Contents
- NVIDIA Jetson™ T5000 module with heat sink and reference carrier board
- DC power 140W
- 802.11ax wireless network interface controller
- 1 TB NVMe populated in M.2 Key-M slot
- Quick Start Guide
Manufacturer Part Number : 945-14070-0080-000
Resources
